Reactive joining of thermally and mechanically sensitive materials

B. Rheingans, R Furrer, J. Neuenschwander, I. Spies, A. Schumacher, S. Knappmann, L.P.H Jeurgens & J. Janczak-Rusch

J. Electron. Packag 140(4), 041006 (2018)

https://doi.org/10.1115/1.4040978

Abstract
/documents/56066/5137854/20180910-Reactive/9227c5d8-22a4-4152-87ea-13fcb3f2a109?t=1537173015230
Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process. For the exemplary case of borosilicate glass, the reactive joining process for a both thermally and mechanically sensitive material is developed. Employing various nondestructive and destructive testing methods, typical problems which can occur upon reactive joining are identified, e.g., exposure of the joining zone to excessive temperatures, experience of thermal shock by the substrate due to sudden temperature increase, and generation of residual stresses in substrate and soldering zone. Utilizing the results of nondestructive and destructive testing, procedures for successful reactive joining of borosilicate glass, silicon and aluminum oxide are provided.