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Transport at Nanoscale Interfaces

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Transport at Nanoscale Interfaces Laboratory

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March 2020 - NEW positions open:

Tenure Track Group Leader in Nanomaterials Spectroscopy & Photonics (pdf)

PhD (pdf) and Postdoc (pdf) on Electron & phonon hydrodynamic transport in engineered 2D materials

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Most recent publications added to DORA Empa

Ma, H.; Sologubenko, A. S.; Döbeli, M.; Sanvito, K.; Heusi, A.; Pletscher, K.; Spolenak, R. The curious mechanism of irradiation-induced cryogenic grain growth in tungsten thin films: a pathway to single crystals. Acta Mater. 2020, 187, 153-165. https://doi.org/10.1016/j.actamat.2019.12.042
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Hedayati, M.; Taheri-Nassaj, E.; Yourdkhani, A.; Borlaf, M.; Zhang, J.; Calame, M.; Sebastian, T.; Payandeh, S.; Clemens, F. J. BaTiO3 nanotubes by co-axial electrospinning: rheological and microstructural investigations. J. Eur. Ceram. Soc. 2020, 40 (4), 1269-1279. https://doi.org/10.1016/j.jeurceramsoc.2019.11.078
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Jacob, P. ESD challenges on RFID devices. Electron. Device Fail. Anal. 2019, 21 (4), 14-20.
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Siol, S.; Ott, N.; Beall, C.; Stiefel, M.; Unutulmazsoy, Y.; Döbeli, M.; Tilley, S. D.; Schmutz, P.; Jeurgens, L. P. H.; Cancellieri, C. A combinatorial guide to phase formation and surface passivation of tungsten titanium oxide prepared by thermal oxidation. Acta Mater. 2020, 186, 95-104. https://doi.org/10.1016/j.actamat.2019.12.026
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Jacob, P. New approaches in ESD risk measurement of PCB assembling machines and ESD countermeasures. In 2019 IEEE 26th international symposium on physical and failure analysis of integrated circuits (IPFA), presented at the 2019 IEEE 26th international symposium on physical and failure analysis of integrated circuits (IPFA), Hangzhou, China, July 2-5, 2019; IEEE: Danvers, MA, 2019; pp 105-110. https://doi.org/10.1109/IPFA47161.2019.8984855
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