HyPELignum - Exploring wooden materials in hybrid printed electronics: a holistic approach towards functional electronics with net zero carbon emissions

Reshaping the life-cycle of electronics; from raw materials to end-of-life; is inevitably one of the fundamental steps to accomplish towards a sustainable economy and society. The ambition of the HyPELignum project is to propose and demonstrate a holistic approach (from sourcing of raw materials until the end-of-life of devices) for the manufacturing of electronics with net zero carbon emissions centred around additive manufacturing and wooden and wood derived materials (i.e. bio-derived or bio-polymers from wood waste). Wood has been identified since it is a largely available and technically versatile material which has and will keep having a key relevance in constructions and households (New European Bauhaus initiative). Furthermore, its biogenic nature makes it pivotal in the European Community effort toward a carbon neutral society. HyPELignum pillars are: (i) implementation of the biogenic material; wood; as substrate for the additive manufacturing of electronic; (ii) implementation of Lignocellulosic materials (from wood production waste), bio-derived resins and abundant and low impact transition metals in the needed functional materials; (iii) the development of highly energy efficient µchip for driving integrated sensing systems; (iv) exploring new avenues for allowing the recycling of wood and recovery of electronic materials. Importantly in addition to the technical development the project will also dedicate a significant effort in the sustainability assessment (life cycle, toxicity, and biodegradability) to: (i) contribute actively to the consolidation of the definition of green and circular electronics and (ii) to propose a decision-making tool for assessment of green and circular electronics.

, Yuliia Dudnyk



Empa - Technology and Society - ERAM

RISE - Research Institutes of Sweden

TNO - Netherlands Organisation for Applied Scientific Research

NIC - National Institute of Chemistry, Slovenia

HFA - Holz­forschung Aus­tria - Aus­trian For­est Prod­ucts Re­search So­ci­ety

CSIC - Spanish National Research Council

ADLER - Werk Lackfabrik Johann Berghofer GmbH & Co KG


Infineon Technologies Austria AG


EU, HORIZON-CL4-2021-DIGITAL-EMERGING-01, Digital and emerging technologies for competitiveness and fit for the green deal



  • Project homepage HyPELignum – Exploring wooden materials in hybrid printed electronics
  • Klose R.; Geiger, T.,
    Green electronics - Circuit boards from renewable raw materials,
    Empa News, Apr 25, 2023

  • chemeurope.com, Circuit boards from renewable raw materials, 03 May 2023

  • Procházka, V.; Kulhaa, P.; Geiger T.; van Zomeren, A.,
    The state of the art and first glimpse of wood based printed electronics,
    49th international conference on Micro and Nano Engineering, Berlin, Germany, 25 - 28 September 2023

  • Ernst, S; Geiger T.,
    Wood instead of plastic? The dream of sustainable products
    Interview, COMPAMED-tradefair.com, 06.09.2023

  • Krautz V., Geiger, T.,
    Platinen auf Cellulosebasis,
    PLUS, 8, 2023

  • Forsthuber, B.; Geiger, T.; Procházka, V.; Spitaler, I.;, Dudnyk, Y.; Nilsson, D.; Kulha P.; van Zomeren, A.; Beni, V.
    Combining additive manufacturing and bioeconomy of wood towards electronics with net zero carbon emissions
    Electronics Goes Green 2024+, Berlin, Germany, June 18-20, 2024


Status: start October 2022

Printed PCB Demonstrator on l-CNF.