Joining Technologies

We offer product-oriented solutions for the joining of complex material systems, from large structures to miniaturized components.

Typical areas of application include

  • Microelectronics and sensor technology

  • Photonics

  • Watch, tool and automotive industry

  • Aerospace and space applications

To this end, we are continuously developing new material and process technology concepts (see Research on Advanced Joining and Nano- & Micro-Joining).

RECENT APPLICATION EXAMPLES

OUR PORTFOLIO

  • Consulting, failure analysis, feasibility studies, prototype development, research and development projects with industrial partners (e.g. Innosuisse), brazing and soldering of small product series

  • Vacuum brazing, gas-shielded brazing and soldering, transient liquid phase bonding, sintering with nano-pastes, reactive joining, hybrid joining processes (coating and brazing), micro- and nanojoining

  • Joint design, residual stress control, surface engineering and interface optimization

  • Mechanical, thermal and chemical integrity (corrosion) of joints

INFRASTRUCTURE

  • Manual Flip-Chip-Bonder (Fineplacer ® pico ma)

  • Wetting angle furnace up to 1000 °C (DSAHT12)

  • Vacuum furnace SCHMETZ type E80/1H

  • Vacuum furnace CVE HL 1218

  • DSC NETZSCH 404C

  • Universal testing machine SHIMADZU AGS-X 100 kN

  • Shear testing machine Walter+Bai STM 20

  • Micro hardness tester FISCHERSCOPE HM 2000

  • REM/EDX HITACHI S-3700

  • X-ray diffraction (XRD)

  • Local electrochemistry

  • Surface analysis (XPS, AES, AFM)

Your contacts