Nano- & Micro-Joining

The continuing trend of heterogeneous integration (i.e. miniaturization, diversification and functionalization) requires novel joining concepts to integrate, package and assemble micro- and nano-scale devices at ever-lower temperatures, flux-free, pressureless and with ever-higher alignment accuracies. To address these industrial demands, we conduct research on nanostructured filler materials, such as nanomultilayers and nanopaste, targeting at the utilization of nanoeffects (e.g. interfacial premelting, directional short-circuit diffusion) for novel nano-/microjoining technologies. Our lab is renowned for its pioneering work on the development of nanostructured brazing fillers with patterned liquid metal outflow and reactive nanomultilayers for room-temperature joining processes (→ our services). Together with our international partners, we are actively shaping the field of Nano-/Microjoining as a new scientific discipline and technology.

OUR RESEARCH

  • Design and synthesis of product-tailored nanopaste formulations and nanothermites through wet chemical synthesis routes.
  • Design and synthesis of nanostructured brazing fillers with tailored nanolayer thicknesses, interface structures and residual stresses by physical vapor deposition techniques.
  • Development of new joining procedures for integrating, packaging and assembling micro- and nano-scale devices
  • Thermodynamics and kinetics of nanopaste sintering, diffusion bonding and competing interfacial phase formation in nanostructured materials (e.g. nanomultilayers, nanothermites and nanopastes) during manufacturing and subsequent operation (→ Advanced Joining)
  • In-situ monitoring of reactions, phase transformations and stress evolutions at heterointerfaces in nanostructured joining materials by laboratory- and synchrotron-based techniques (e.g. XRD, XPS/HAXPES, TEM, SEM)

 

SELECTED PUBLICATIONS

nanojoining, mirojoining, packaging, micro assembly, flip-chip bonding, die bonding, nanobonding, reactive joining, nanopaste, nanoparticle, nanomultilayers, nanothermite, coating, foil, sintering, wetting, stress, melting point depression, nano-joining, micro-joining
nanojoining, mirojoining, packaging, micro assembly, flip-chip bonding, die bonding, nanobonding, reactive joining, nanopaste, nanoparticle, nanomultilayers, nanothermite, coating, foil, sintering, wetting, stress, melting point depression, nano-joining, micro-joining
nanojoining, mirojoining, packaging, micro assembly, flip-chip bonding, die bonding, nanobonding, reactive joining, nanopaste, nanoparticle, nanomultilayers, nanothermite, coating, foil, sintering, wetting, stress, melting point depression, nano-joining, micro-joining
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