Anbei finden Sie eine Liste mit Schulungsunterlagen und vergangenen Veröffentlichungen. Mitglieder vom Pool haben mit ihrem login Zugriff auf einige der Dokumente hier.

Jacob, P.; Furrer, R. A very unusual transistor failure, caused by a solenoid. Microelectronics and Reliability 2017, xx (4 pp.).


Jacob, P. Early life field failures in modern automotive electronics ? an overview; root causes and precautions. Microelectronics and Reliability 2016, 64, 79-83.


Jacob, P. Failure mechanisms and precautions in plug connectors and relays. Microelectronics and Reliability 2016, 64, 693-698.


Held, M.; Brönnimann, R. Safe cell, safe battery? Battery fire investigation using FMEA, FTA and practical experiments. Microelectronics and Reliability 2016, 64, 705-710.


Jacob, P.; Pecnik, C.; Nicoletti, G.; Broennimann, R. Recovering contacting interfaces in packaging and in semiconductor devices: mechanisms and how to handle them in analysis; Marina Bay Sands, Singapore, 2016; p 6 pp.


Cuervo-Reyes, E.; Scheller, C. P.; Held, M.; Sennhauser, U. A unifying view of the constant-phase-element and its role as an aging indicator for Li-Ion batteries. Journal of the Electrochemical Society 2015, 162 (8), A1585-A1591.


Jacob, P. Capacitors-the helpers of active devices: a failure analyst's (re)view. Electronic Device Failure Analysis 2015, 17 (4), 22-28.


Grossmann, G.; Nicoletti, G. Lead free BGAs soldered with SnPb36Ag2 solder. Materials Transactions 2015, 56 (7), 988-991.


Jacob, P. Failure analysis and reliability on system level. Microelectronics and Reliability 2015, 55 (9), 2154-2158.


Held, M.; Sennhauser, U. Stress-induced ageing of Lithium-ion batteries. Chimia 2015, 69 (12), 737-740.


Jacob, P. Unusual defects, generated by wafer sawing: an update, including pick&place processing. Microelectronics and Reliability 2015, 55 (9), 1826-1831.


Jacob, P. Anamnesis in Failure Analysis - How a System-Related Approach Can Save Failure Analysis (FA) Time, Shorten Learning Loops and Reduce Cost; ASM International: San Jose, California, USA, 2013; pp 99-104.


Jacob, P. Die neue Richtlinie 1013 des ESD-Forums und erste Erfahrungen; ESD Forum e.V.: Berlin, 2013; p 4 pp.


Jacob, P. ESD and/versus EOS?what's new about it? Electronic Device Failure Analysis 2013, 15 (2), 4-13.


Jacob, P.; Nicoletti, G. Failure causes generating aluminium protrusion/extrusion. Microelectronics and Reliability 2013, 53 (9), 1553-1557.


Jacob, P. Was passiert bei Elektrostatischen Entladungen aus Kunststoffen?; ESD Forum e.V.: Berlin, 2013; p 15 pp.


Jacob, P. Device analysis: a system-related topic? Electronic Device Failure Analysis 2012, 14 (2), 45-46.


Jacob, P.; Gärtner, R.; Gieser, H.; Helling, K.; Pfeifle, R.; Thiemann, U.; Wulfert, F.; Rothkirch, W. ESD risk evaluation of automatic semiconductor process equipment - A new guideline of the german ESD forum e.V; IEEE: Tucson, AZ, 2012; p 13072374 (10 pp.).


Grossmann, G.; Weiss, C. Measurement method for the assessment of the energy consumption of cooking setups. Journal of Testing and Evaluation 2011, 39 (3), JTE102997 (5 pp.).


The Elfnet book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects;  Grossmann, G., Zardini, C., Eds.; Springer: London, 2011.


Jacob, P. From component to system failure analysis - the future challenge within work-sharing supply chains. Microelectronics and Reliability 2011, 51 (9), 1618-1623.


Jacob, P. How could device security against unauthorized internal chip access be married with design for testability?; IEEE: Singapore, Republic of Singapore, 2010; pp 368-371.


Jacob, P.; Jerjen, I.; Nicoletti, G. Root-cause investigations of stitch bond-shearing by means of 3D-X-ray computer tomography (XCT), metallographic polishing and FIB; ASM: Dallas Tx., USA, 2010; pp 444-448.


Jacob, P.; Knecht, W. ESD-ähnliche Überspannungen an Mikrochips infolge induktiver Lasten: Fallbeispiele und Vorschläge für Gegenmassnahmen und Tests; Gottschalk, A., Ed.; Berlin, Deutschland, 2009; pp 99-104.


Jacob, P. Poly-si extensions and etching residues as a reliability risk. Microsystem Technologies 2009, 15 (1), 169-174.


Held, M.; Fritz, K. Comparison and evaluation of newest failure rate prediction models: FIDES and RIAC 217Plus. Microelectronics and Reliability 2009, 49 (9), 967-971.


Jacob, P.; Knecht, W.; Kunz, A.; Nicoletti, G.; Lautenschlager, T.; Mondada, M.; Pachoud, D. Reading distance degradation mechanisms of near-field RFID devices. Microelectronics and Reliability 2009, 49 (9), 1288-1292.


Jacob, P.; Nicoletti, G. Humidity-induced semiconductor device electrical reliability failures: mechanism and wafer-level risk evaluation/electrical screening-test proposal; Grand Copthorne Waterfront Hotel, Singapore, 2008; Vol. 48, p 4 pp.


Jacob, P.; Rütsch, M. Microelectronic components: how reliability impacts sustainability industry; Berlin, Germany, 2008; pp 237-240.


Jacob, P. Surface ESD (ESDFOS) in assembly fab machineries as a functional and reliability risk - Failure analysis, tool diagnosis and on-site-remedies. Microelectronics and Reliability 2008, 48 (8), 1608-1612.


Jacob, P.; Rothkirch, W. Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures. Microelectronics and Reliability 2008, 48 (8), 1253-1257.


Jacob, P.; Nicoletti, G.; Hauf, F. Device decapsulated (and/or depassivated) - Retest ok - What happened? Microelectronics and Reliability 2007, 47 (9), 1574-1579.


Tharian, J.; Jacob, P. Degradation- and failure mode analysis of III-V nitride devices; Bangalore, India, 2007; p 4 pp.


Zhou, L.; Held, M.; Sennhauser, U. Connection availability analysis of shared backup path-protected mesh networks. Journal of Lightwave Technology 2007, 25 (5), 1111-1119.


Brönnimann, R.; Held, M.; Nellen, P. M. Reliability, standardization, and validation of optical fiber sensors; Cancún, México, 2006; p 4 pp.


Jacob, P. RFID (Radio frequency identification devices) - A new, important challenge for future electronic waste recycling; Vienna, Austria, 2006; p 5 pp.


Jacob, P.; Kunz, A.; Nicoletti, G. Reliability and wearout characterisation of LEDs. Microelectronics and Reliability 2006, 46 (9), 1711-1714.


Jacob, P.; Nicoletti, G. Surface electrostatic damage by microprocess robotic machines: Diagnosis and reliability, process auditing, and remedies. IEEE Transactions on Device and Materials Reliability 2006, 6 (2), 213-220.


Jud, P. P.; Grossmann, G.; Sennhauser, U.; Uggowitzer, P. J. Local fatigue in lead-free SnAg3.8Cu0.7 solder. Advanced Engineering Materials 2006, 8 (3), 179-183.


Grossmann, G. Accelerated testing methodology for lead-free solder interconnects. In Lead-Free Solder: Interconnect reliability; Shangguan, D., Ed.; ASM International: Materials Park, Ohio, 2005; pp 165-179.


Grossmann, G.; Tharian, J.; Jud, P.; Sennhauser, U. Microstructural investigation of lead-free BGAs soldered with tin-lead solder. Soldering and Surface Mount Technology 2005, 17 (2), 10-21.


Grossmann, G.; Jud, P. P.; Sennhauser, U. Microstructure and deformation behavior of SnAg3.8Cu0.7 lead- free solder. In The world of electronic packaging and system integration; Aschenbrenner, R., Michel, B., Eds.; DDP Goldenbogen, 2005; pp 285-291.


Jud, P. P.; Grossmann, G.; Sennhauser, U. FIB investigations of local deformation in lead-free solder; Nürnberg, Germany, 2005; pp 99-103.


Jud, P. P.; Grossmann, G.; Sennhauser, U.; Uggowitzer, P. J. Local creep in SnAg3.8Cu0.7 lead-free solder. Journal of Electronic Materials 2005, 34 (9), 1206-1214.


Jud, P. P.; Grossmann, G.; Sennhauser, U. Local creep in lead free SnAg3.8Cu0.7 solder; Barcelona, Spain, 2005; p 5 pp.


Kräuchi, P.; Wäger, P. A.; Eugster, M.; Grossmann, G.; Hilty, L. End-of-life impacts of pervasive computing. Are RFID tags a threat to waste management processes? IEEE Technology and Society Magazine 2005, 24 (1), 45-53.


Jacob, P.; Reiner, J. Assembly processes - a surface electrostatic discharge killer for devices and a FA challenge. Electronic Device Failure Analysis 2005, 7 (2), 6-12.


Jacob, P.; Thiemann, U.; Reiner, J. C. Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing. Microelectronics and Reliability 2005, 45 (7), 1174-1180.


Jacob, P. RFID - drahtlose Identifikation; eine Technologie mit Potential. Bulletin SEV/VSE, Fachzeitschrift und Verbandsinformationen von Electrosuisse und VSE. Electrosuisse 2005, pp 9-12.


Scheuerlein, C.; Gasser, P.; Jacob, P.; Leroy, D.; Oberli, L.; Taborelli, M. The effect of CuSn intermetallics on the interstrand contact resistance in superconducting cables for the large hadron collider. Journal of Applied Physics 2005, 97, 033909 (7 pp.).


Jacob, P.; Reiner, J. C. Electrostatic effects on semiconductor tools. Microelectronics and Reliability 2004, 44 (9), 1787-1792.


Held, M.; Sennhauser, U. Failure rate prediction models used for reliability monitoring of electronic systems; Berlin, Germany, 2004; pp 939-944.


Nellen, P. M.; Brönnimann, R.; Held, M.; Sennhauser, U. Long-term monitoring of polarization-mode dispersion of aerial optical cables with respect to line availability. Journal of Lightwave Technology 2004, 22 (8), 1848-1855.


Wosinska, L.; Held, M. Optimization of optical networks: price and value of reliability; Wroclaw, Poland, 2004; pp 53-58.


Zhou, L.; Held, M.; Wosinska, L. Analysis and optimization of connection availabilities in optical networks with different protection strategies; Strasbourg, France, 2004; Vol. 5465, pp 157-167.


Sennhauser, U.; Jacob, P.; Gasser, P. Anwendung der FIB für Materialwissenschaften und Fehleranalyse. Using FIB for materials science and failure analysis. Praktische Metallographie 2004, 41, 199-209.

Jacob, P.; Thiemann, U. Elektrostatische Entladungen direkt auf die Chipoberfläche bei Verarbeitungsprozessen ab Wafer-Level. Schadensbilder, Zuverlässigkeitsaspekte, Analysen und Prozessursachen; 2003; pp 131-137.


Held, M.; Nellen, P. M.; Wosinska, L. Availability calculation and simulation of optical network systems; Brugge, Belgium, 2003; Vol. 4940, pp 163-173.


Held, M.; Nellen, P. M.; Wosinska, L. Availability optimization by sensitivity analysis of fiber optical network systems; Maastricht, Netherlands, 2003; Vol. 1, pp 791-799.


Held, M.; Wosinska, L.; Nellen, P. M.; Mauz, C. Consideration of connection availability optimization in optical networks; Banff, Canada, 2003; pp 173-180.


Held, M.; Brönnimann, R.; Nellen, P. M. Long term stability of aerial optical cables with respect to gigabit/s data rates; Brugge, Belgium, 2003; Vol. 4940, pp 47-58.


Nellen, P. M.; Held, M. Reliability and failure analysis of fiber optical network components; Brugge, Belgium, 2003; Vol. 4940, pp 195-206.


Nellen, P. M.; Brönnimann, R.; Held, M.; Sennhauser, U. Reliability in fiber optical sensor applications; Brugge, Belgium, 2003; Vol. 4940, pp 195-206.


Affolter, C.; Grossmann, G. Thermomechanische Modellierung von Lötverbindungen mit angepasstem Kriechgesetz bleifreier Lote; Wiley-VCH: Vienna, Austria, 2003; pp 821-826.

2002 and before

Grossmann, G. Grundlagen des Weichlötens; Regensburg, Germany, 2002; p 29 pp.


Grossmann, G.; Tharian, J.; Fleischer, W. No fear of lead-free solder; Zürich, Switzerland, 2002; pp 303-308.


Grossmann, G.; Nicoletti, G.; Solèr, U. Results of comparative reliability tests on lead-free solder alloys; San Diego, CA, USA, 2002; pp 1232-1237.


Jacob, P. Defect- and structure- weakness- localization on power semiconductors using OBIRCH (Optical Beam Induced Resistivity Change); Singapore, 2002; pp 152-156.


Jacob, P. Microstructure device modifications by FIB: what a device designer should consider when asking for FIB repair support; Lugano, Switzerland, 2002; pp 334-335.


Sennhauser, U.; Jacob, P. FIB - ein Mikroskop als Werkbank. GIT Labor-Fachzeitschrift. GIT Verlag 2002, pp 1158-1159.


Sennhauser, U.; Jacob, P. FIB - ein Mikroskop als Werkbank. Focused Ion Beam für die Materialwissenschaften. Inspect: Bildverarbeitung, Oberfläche, Mikroskopie 2002, No. 2, 63-64.


Grossmann, G. Bleifreies Löten: Materialien, Eigenschaften, Prozesse; Karlsruhe, 2001; Vol. 57, p 7 pp.


Grossmann, G. Die Zuverlässigkeit von Lötstellen; Mallorca, 2001; p 23 pp.


Grossmann, G. Die Zuverlässigkeit von Lötstellen; Oberpfaffenhofen bei München, 2001; p 22 pp.


Grossmann, G. Eureka Project E! 2368 Leadfree; Tokio, 2001; p 5 pp.


Grossmann, G. Grundlagen der Löttechnik; Bamberg, 2001; p 51 pp.


Grossmann, G. Lead-free soldering, a state of the art; Berlin, 2000; Vol. 1, pp 61-66.


Grossmann, G.; Affolter, C. Magnitude and location of strain in SMT solder joints; Berlin, 2000; pp 448-451.


Grossmann, G. Werkstofftechnische Eigenschaften des Lotes, Teil 1+2; Würzburg, 2000; p 45 pp.



Jacob, P.; Nicoletti, G. Design and reliability aspects of multi-level-metal large-scale- power line layouts in ULSI-ICs; Santa Clara, USA, 2000; Vol. 4182, pp 159-165.


Jacob, P.; Nicoletti, G. New FIB-supported approach for wirebond characterization; Bellevue, Wash., 2000; pp 35-40.


Acovic, A.; Buffat, P. A.; Brander, P.; Jacob, P.; Jeandupeux, O.; Marsico, V.; Rosenfeld, D.; Moser, J.; Kohli, M.; Fluckiger, R.; et al. Identification of amorphous silicon residues in low power CMOS technology; Santa Clara, Calif., 1999; Vol. 3884, pp 256-264.


Held, M.; Nicoletti, G.; Jacob, P.; Chave, J.; Kayal, A. -H.; Lisowski, L.; Theurillat, P. Fahrprofil-Tests für IGBTs in Elektrofahrzeugen; Freiburg i. Br., 1999; pp 25-42705.


Held, M.; Jacob, P.; Nicoletti, G.; Scacco, P.; Poech, M. -H. Fast power cycling test for insulated gate bipolar transistor modules in traction application. International Journal of Electronics 1999, 86 (10), 1193-1204.


Jacob, P. J.; Doering, E. FIB-voltage-contrast-localization and analysis of contact-via- chains; Edinburgh, 1999; Vol. 3743, pp 273-279.


Grossmann, G. Metallkundliche Grundlagen zur Zuverlässigkeit von Weichlötstellen. Produktion von Leiterplatten und Systemen 1999, 1 (11), 1642-1648.


Grossmann, G. The deformation behavior of Sn62Pb36Ag2 and its implications on the design of thermal cycling tests for electronic assemblies. IEEE Transactions on Electronics Packaging Manufacturing 1999, 22 (1), 71-79.


Jacob, P.; Schertel, A.; Peto, L.; Sundaram, G. New FIB-supported approaches for EELS-capable TEM-lamella preparation; Singapur, 1999; pp 69-72.


Jacob, P.; Schürch, S.; Holberg, T. Re-use of integrated circuits (IC's) as an added-value in recycling of electronic waste; Wien, 1998; pp 175-180.