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Transport at Nanoscale Interfaces

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Ma, H.; Sologubenko, A. S.; Döbeli, M.; Sanvito, K.; Heusi, A.; Pletscher, K.; Spolenak, R. The curious mechanism of irradiation-induced cryogenic grain growth in tungsten thin films: a pathway to single crystals. Acta Mater. 2020, 187, 153-165. https://doi.org/10.1016/j.actamat.2019.12.042
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Hedayati, M.; Taheri-Nassaj, E.; Yourdkhani, A.; Borlaf, M.; Zhang, J.; Calame, M.; Sebastian, T.; Payandeh, S.; Clemens, F. J. BaTiO3 nanotubes by co-axial electrospinning: rheological and microstructural investigations. J. Eur. Ceram. Soc. 2020, 40 (4), 1269-1279. https://doi.org/10.1016/j.jeurceramsoc.2019.11.078
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Jacob, P. ESD challenges on RFID devices. Electron. Device Fail. Anal. 2019, 21 (4), 14-20.
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Siol, S.; Ott, N.; Beall, C.; Stiefel, M.; Unutulmazsoy, Y.; Döbeli, M.; Tilley, S. D.; Schmutz, P.; Jeurgens, L. P. H.; Cancellieri, C. A combinatorial guide to phase formation and surface passivation of tungsten titanium oxide prepared by thermal oxidation. Acta Mater. 2020, 186, 95-104. https://doi.org/10.1016/j.actamat.2019.12.026
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Jacob, P. New approaches in ESD risk measurement of PCB assembling machines and ESD countermeasures. In 2019 IEEE 26th international symposium on physical and failure analysis of integrated circuits (IPFA), presented at the 2019 IEEE 26th international symposium on physical and failure analysis of integrated circuits (IPFA), Hangzhou, China, July 2-5, 2019; IEEE: Danvers, MA, 2019; pp 105-110. https://doi.org/10.1109/IPFA47161.2019.8984855
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