Joining Technologies

We offer product-oriented solutions for the joining of complex material systems, from large structures to miniaturized components.

Typical areas of application include

  • Microelectronics and sensor technology

  • Photonics

  • Watch, tool and automotive industry

  • Aerospace and space applications

To this end, we are continuously developing new material and process technology concepts (see Research on Advanced Joining and Nano- & Micro-Joining).

RECENT APPLICATION EXAMPLES

OUR PORTFOLIO

  • Consulting, failure analysis, feasibility studies, prototype development, research and development projects with industrial partners (e.g. Innosuisse), brazing and soldering of small product series

  • Vacuum brazing, gas-shielded brazing and soldering, transient liquid phase bonding, sintering with nano-pastes, reactive joining, hybrid joining processes (coating and brazing), micro- and nanojoining

  • Joint design, residual stress control, surface engineering and interface optimization

  • Mechanical, thermal and chemical integrity (corrosion) of joints

INFRASTRUCTURE

  • Manual Flip-Chip-Bonder (Fineplacer ® pico ma)

  • Wetting angle furnace up to 1000 °C (DSAHT12)

  • Vacuum furnace SCHMETZ type E80/1H

  • Vacuum furnace CVE HL 1218

  • DSC NETZSCH 404C

  • Universal testing machine SHIMADZU AGS-X 100 kN

  • Shear testing machine Walter+Bai STM 20

  • Micro hardness tester FISCHERSCOPE HM 2000

  • REM/EDX HITACHI S-3700

  • X-ray diffraction (XRD)

  • Local electrochemistry

  • Surface analysis (XPS, AES, AFM)

joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult
joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult
joining technologies, joining, packaging, assembly, brazing, soldering, bonding, diffusion bonding, transient liquid phase bonding, TLP, nanopaste, nanopaste sintering, nanopaste bonding, reactive joining, filler, nanofiller, foil, nanofoil, nanomultilayer, solder, braze, surface coating, metallization, metal-ceramic, joint assembly, nanojoining, microjoining, packaging, integration, flip-chip bonding, die bonding, reflow, nanopaste, reactive joining, flip-chip bonding, die bonding, reflow, research, service, advise, consult

Your contacts


Dr. Bastian Rheingans

Dr. Bastian Rheingans
Scientist (Deputy Group Leader)

Phone: +41 58 765 4371