Micro- & Nano-Joining

Key industries in the field of (micro-)electronics, nano-technologies and sensing devices have an urgent need for novel joining concepts to integrate, package and assemble micro- and nano-scale devices at ever-lower temperatures. Our lab is renowned for its pioneering research on reactive joining and the design of nano-structured brazing fillers for emerging micro- and nano-joining technologies. We conduct innovative research on interface-controlled reactions and phase transformations in nano-structured filler materials and surface coatings for advanced joining technologies.


  • Microstructural design, fabrication and application of nano-structured coatings, reactive foils and (nano)composite filler materials for joining heat-sensitive and miniaturized components at ever-lower temperatures.

  • Development of reactive foil technologies and novel nano-thermite systems with controlled ignition and reaction temperatures for room-temperature joining of a wide variety of materials under ambient conditions.

  • Adaption of conventional joining processes and development of new joining procedures for integrating, packaging and assembling micro- and nano-scale devices.


  • Diffusion, wetting, nucleation, (pre)melting and (metastable) phase formation at reacting surfaces and interfaces in nanostructured materials and coating systems.

  • Interfacial design and fabrication of nano-structured fillers, reactive nanomultilayers and nano-thermites by physical vapour deposition and chemical synthesis techniques.

  • Real-time in-situ monitoring of microstructural evolutions and reactions kinetics at reacting interfaces in nano-materials by laboratory- and synchrotron-based techniques (e.g. in-situ XRD, XAS, TEM, SEM, XPS and AES).