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About us
Research, Testing, Analysis and Knowledge transfer:
Qualification and reliability of components, devices and systems
- Reliability, availability and maintainability analysis
- Qualification and reliability tests
- Failure analysis
- Electrical characteristics of materials, components, devices and structures
- Electromagnetic compatility (radio-frequency immunity, radio frequency emission, electrostatic discharge, burst, surge, voltage dips and interruptions)
- Major equipment: SEM, TEM, FIB, X-ray microscope, wafer prober, curve tracer, IR-scanning, shaker, climate chambers, EMC-chamber
Reliability Centre (ZZT) |
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Measurement technology
- Research and development of optical measuring techniques and structural monitoring systems
- Measurement of strain, displacement, shape, position, force, pressure, temperature and electric variables
- RSG, inductive, potentiometric and fiber optic sensors
- Coordinate measuring machine
- Moiré and fringe projection, laser, electronic speckle and shearographic interferometry
- Thermography
- Data acquisition up to 800 channels
- Calibration of instuments and systems
- Statistical methodes and estimation of the measurement uncertainty
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Non-destructive testing
- Radiographic tests (film, digital, microfocus)
- Computer and µ-computertomography
- Ultrasonic tests, phased array system
- Magnetic particle testing
- Liquid penetration testing
Centre for Non-destructive Testing |
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Electronics and Automation
- Evaluation, development and construction of measuring systems
- Integration of complete systems
- Hardware and software development
Accreditation according to EN 45001 as testings laboratory STS 059 for qualification, reliability and non-destructive examinations of materials, components and systems.
Contact: Dr. U. Sennhauser, Head of Section, e-mail: urs.sennhauser@empa.ch phone 41 1 823 41 73, fax 41 1 823 40 54. Erika Krause, Administration, e-mail: erika.krause@empa.ch, phone 41 1 823 42 72, fax 41 1 823 40 54 |
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SMT solder joint after 8000 thermal cycles
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Interferometric measurement of a silicon pressure sensor
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Reverse engineering with computer tomography (courtesy of Bombardier-Rotax)
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Manual equipment of Print-Prototypes
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