Electronics/Metrology/Reliability  
Reliability/Safety
Micro- / Nanotechnology
X-ray / Ultrasound / Imaging
Monitoring / Metrology
Electronics

Section Electronics/Metrology

 

About us

Research, Testing, Analysis and Knowledge transfer:

 

Qualification and reliability of components, devices and systems

  • Reliability, availability and maintainability analysis
  • Qualification and reliability tests
  • Failure analysis
  • Electrical characteristics of materials, components, devices and structures
  • Electromagnetic compatility (radio-frequency immunity, radio frequency emission, electrostatic discharge, burst, surge, voltage dips and interruptions)
  • Major equipment: SEM, TEM, FIB, X-ray microscope, wafer prober, curve tracer, IR-scanning, shaker, climate chambers, EMC-chamber

    Reliability Centre (ZZT)

Measurement technology

  • Research and development of optical measuring techniques and structural monitoring systems
  • Measurement of strain, displacement, shape, position, force, pressure, temperature and electric variables
  • RSG, inductive, potentiometric and fiber optic sensors
  • Coordinate measuring machine
  • Moiré and fringe projection, laser, electronic speckle and shearographic interferometry
  • Thermography
  • Data acquisition up to 800 channels
  • Calibration of instuments and systems
  • Statistical methodes and estimation of the measurement uncertainty

Non-destructive testing

  • Radiographic tests (film, digital, microfocus)
  • Computer and µ-computertomography
  • Ultrasonic tests, phased array system
  • Magnetic particle testing
  • Liquid penetration testing

    Centre for Non-destructive Testing

Electronics and Automation

  • Evaluation, development and construction of measuring systems
  • Integration of complete systems
  • Hardware and software development


 

Accreditation according to EN 45001 as testings laboratory STS 059 for qualification, reliability and non-destructive examinations of materials, components and systems.

 

Contact:
Dr. U. Sennhauser, Head of Section, e-mail: urs.sennhauser@empa.ch
phone 41 1 823 41 73, fax 41 1 823 40 54. Erika Krause, Administration, e-mail: erika.krause@empa.ch, phone 41 1 823 42 72, fax 41 1 823 40 54

SMT solder joint after 8000 thermal cycles
Interferometric measurement of a silicon pressure sensor
Reverse engineering with computer tomography (courtesy of Bombardier-Rotax)
Manual equipment of Print-Prototypes

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