Metallic materials exhibit higher and higher yield strength as their external dimensions are reduced. Even pure Cu can exhibit yield stresses in the gigapascal range when its film thickness reaches the nanoscale. However, when thin films stacks, such as Cu/Ta, are investigated, fracture is observed when the layer thickness becomes smaller than a critical value of about 100 nm. Apparently there is an 'ideal' length scale at which the materials properties become optimal.
This talk will focus on novel synchrotron techniques that enable the in situ tensile testing of metallic films as thin as 20 nm. Recent results on the scaling of yield stress as well as fracture toughness in Cu and Cu/Ta systems will be presented and discussed in the light of thin film plasticity and fracture mechanics.

Vortragssprache: Englisch